effect of compound complex agent in electroless plating ni-fe-p alloy on glass fibre 合金工艺中复合络合剂的影响
effects of complex agent on the nanocrystalline copper powders prepared by reduction in acqueous solution 络合剂对液相还原法制备纳米铜粉的作用
the relationship between the concentration of stabilizers, the rate of agitation, the concentration and series of the complex agents and the deposition rate was also studied in this paper 并具有一定的雷达吸波性能。另外,对溶液中稳定剂的浓度、搅拌速度、络合剂种类和含量与沉积速度的关系进行了初步探讨。
the orthogonal experiment has been used to optimize the electrolyte composition and the craft parameters, with the increasing of the main salt and reducing agent concentration in the electrolyte, the electroless plating coating ’ s adhesive strength and the coverage ratio also increase; increasing the complex agent content, the electroless plating coating ’ s adhesive strength and the coverage ratio exist the maximum value; the electroless plating deposition rate distinctly increases when the electrolyte temperature and the ph value were increased, but the increasing of temperature and ph value affects the electrolyte ’ s stability 采用正交实验对镀液成分、工艺参数进行了优化,随着镀液主盐、还原剂添加量的增加,镀层结合强度及其覆盖面依次增强,随着络合剂添加量的增加,镀层结合强度及其覆盖面先增加然后减少,随着镀液温度及其ph值的升高,化学镀沉积速度明显提高,但影响镀液的稳定性。